Modi and Japan PM Ride Shinkansen to Sendai, Spotlight on India–Japan Tech Ties
Prime Minister Narendra Modi’s two-day visit to Japan combined diplomacy with powerful symbolism on Saturday as he boarded the world-famous Shinkansen bullet train alongside Japanese Prime Minister Shigeru Ishiba.
The two leaders travelled from Tokyo to Sendai together, with Ishiba personally accompanying Modi during the journey. Sharing the moment on X (formerly Twitter), Ishiba wrote: “With Prime Minister Modi to Sendai. Continuing from last night, I will be with you in the car.” The gesture highlighted the warmth between the two leaders and reinforced the growing spirit of India–Japan friendship.
From Trains to Trade Talks
Earlier in the day, PM Modi also interacted with Indian train drivers undergoing training at JR East, a collaboration symbolizing the close ties between the two nations. Ishiba, who shared photos of the interaction, called it a proud reflection of India–Japan cooperation.
Beyond the symbolic train ride, the leaders held extensive discussions on defence, economy, and advanced technology collaboration. “We discussed cooperation across a wide range of areas, including defence and the economy. Tomorrow, I will join you for the inspection of the Shinkansen and semiconductor-related matters,” Ishiba posted on X.
Focus on Semiconductors
A major highlight of Modi’s Sendai visit was his tour of a state-of-the-art semiconductor facility in Miyagi Prefecture. The plant, developed by Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC), SBI Holdings, and Japanese partners under the joint venture Japan Semiconductor Manufacturing Company (JSMC), is regarded as one of Japan’s boldest initiatives to revive its domestic chip-making industry.
Located in Ohira Village’s Second Northern Sendai Central Industrial Park, the facility will manufacture 12-inch semiconductor wafers. Production is set to begin with 40-nanometre technology, followed by expansion into 28 nm and 55 nm nodes, with a strong emphasis on automotive electronics—a sector rapidly growing with the global rise of electric and next-generation vehicles.
Boost to Tech Partnerships
Once fully operational, the Sendai facility is expected to produce around 40,000 wafers per month, significantly enhancing Japan’s semiconductor self-reliance while also boosting India–Japan collaboration in high-tech manufacturing.
PM Modi’s bullet train journey with Ishiba, combined with the semiconductor focus, sends a clear message: the India–Japan partnership is not only rooted in tradition and friendship but also firmly aligned with the future of technology and global supply chains.
Read more: Top Business Magazine
